Sensor Assembly Research & Development Engineer(d/m/f)
Premstätten, Styria, Austria – ams-OSRAM AG
What we expect
• Develop packages & package technologies for computed tomography and optical sensors (ambient light, color, proximity) as part of the engineering team
• Carry out package design (mechanical & optical design, simulations) and manufacturing at assembly partners
• Interface with IC design, quality, assembly, test, product management and application teams & represent package development in multi-disciplinary / multi-site product development teams
• Execute package development to successful completion within given resource constraints (time, budget)
• Continuously improve package technologies to achieve time, quality and cost targets
• Select technologies, components, materials & suppliers for new packages together with R&D, Operations & Quality
• Identify cost improvements for high volume production
• Identify new suppliers / technologies
Who we are looking for
• Advanced university degree in Physics, Chemistry, Materials Science, Optics, Polymer / Mechanical / Semiconductor Engineering, or related fields
• 5 year+ experience in advanced semiconductor packaging
• Technical modelling and drawing in SolidWorks and AutoCAD
• Experience in high volume manufacturing for consumer electronics applications is a benefit
• Experience in collaboration with external manufacturing partners (OSATs)
• Failure analysis and reliability engineering knowledge
• Basic knowledge of MEMS and CMOS manufacturing technologies
• Demonstrated analytical and problem solving skills
• Hands-on-mentality, ability to execute developments within tight resource constraints (time, budget)
• Ability to cope with high workloads in critical project stages
• Ability to work in & collaborate with diverse teams in multiple geographical locations
• Strong communication skills
• Creativity and problem solving skills
• Fluent English
We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.
Contact
Yong Pan will be happy to answer any questions you may have.
Phone: +43 3136 500 32660
E-Mail: yong.pan@ams-osram.com
For data protection reasons, we only accept applications submitted through our applicant portal. This allows you to view the status of your application in your profile at any time.
Job details
Posting date: | 2025/04/08 |
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Experience level: | Professional (> 3 Years) |
Type of contract: | Permanent |
Employment type: | Full-time |
Work Model: | Hybrid |
Business unit: | CMOS Sensors & ASICs |
Organization: | ams-OSRAM AG |
Job field: | Research & Development |
Job ID: | 20361 |