Die Attach/Wire Bond Process Development Senior Engineer
Bayan Lepas, Penang, Malaysia – OSRAM OS Penang
What we expect
- Develop or optimize Die Attach and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
- Participate and support FOL processes tehcnology roadmap and building block activities.
- Equipment selection which meet project cost, quality and timeline target.
- Share and transfer technical know how within R&D and to Manufacturing team.
- Provide technical guidance or job coaching to junior supporting staff
- Participate in engineering sample, pre-series and ramp-up build to fulfill custoemr order.
Who we are looking for
- Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
- 2-3 years in semiconductor field especially in Die Attach and Wire Bond processes.
- Process egnineering knowledge in semiconductors or LED manufacturing processes.
- Knowledge in process development step and statistic.
- B. Minitab knowledge will be advantage.
- Six Sigma Green or Black Belt will be advantage.
Contact

Nurul Ain Rosli will be happy to answer any questions you may have.
E-Mail: nurul-ain.rosli@ams-osram.com
For data protection reasons, we only accept applications submitted through our applicant portal. This allows you to view the status of your application in your profile at any time.
Job details
Posting date: | 2025/07/04 |
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Experience level: | Professional (> 3 Years) |
Type of contract: | Permanent |
Employment type: | Full-time |
Work Model: | On site |
Business unit: | Opto Semiconductors (OS) |
Organization: | OSRAM OS Penang |
Job field: | Research & Development |
Job ID: | 19853 |