你的职责
- Close cooperation with the whole product development team (NPI, Project Management, Design, Apps, Etc.) to ensure testability of IC products in a very early product design phase. This may include but not limited to influencing the product design engineer to consider design for test (DFT) considerations such as developing the best test concepts and practices for Wafer Level and Package Level tests.
- Responsible in the definition and development of a new product test solution taking into account device datasheet requirements, development cost, lead time and test coverage. This test solution will include mass volume wafer level test and Package Final test (Ex. Load board, probe card, Etc.)
- Acts as the overall lead for all back-end manufacturing development needs. This may include project planning, providing quotes for product test times, HW/SW development, debug and characterization.
- Responsible for the pre-production cycle of new product development. Tasks include the creation of HW and SW both for Final Test and Wafer sort. Debug and qualification of all test parameters as per datasheet requirements thereby ensuring very good test coverage, a repeatable, stable and quality driven test solution. As part of the process, you will transfer all product know-how that was gained and encountered during the development phase. This may include knowledge transfer activities such as trainings, transfer of technical documentation and solutions, Etc.
