Sensor Assembly Research & Development Engineer(d/m/f)
普雷姆施泰滕, 施蒂利亚州, 奥地利 – ams-OSRAM AG
职位要求
• Develop packages & package technologies for computed tomography and optical sensors (ambient light, color, proximity) as part of the engineering team
• Carry out package design (mechanical & optical design, simulations) and manufacturing at assembly partners
• Interface with IC design, quality, assembly, test, product management and application teams & represent package development in multi-disciplinary / multi-site product development teams
• Execute package development to successful completion within given resource constraints (time, budget)
• Continuously improve package technologies to achieve time, quality and cost targets
• Select technologies, components, materials & suppliers for new packages together with R&D, Operations & Quality
• Identify cost improvements for high volume production
• Identify new suppliers / technologies
联系我们
Yong Pan 将很乐意回答您的任何问题。
电子邮件地址: yong.pan@ams-osram.com
出于信息保护的原因，我们仅接受官方岗位申请渠道的申请投递。您也可以通过岗位主页查询您的申请进度。
工作细节
| 发布日期: | 2025/04/08 |
|---|---|
| 经验水平: | 专业（> 3年) |
| 合同类型: | 正式 |
| 时间安排: | 全职 |
| 工作模式: | 混合 |
| 业务单元: | CMOS Sensors & ASICs |
| 组织: | ams-OSRAM AG |
| 工作领域: | 研发 |
| 工作编号: | 20361 |
