FEA Simulation Engineer - Sensor Assembly R&D (d/m/f)
Premstätten, Styria, Austria – ams-OSRAM AG
What we expect
- Reliability simulation and risk assessment of optical sensor packages with focus on thermal and (thermo-)mechanical design
- Process modelling of critical packaging assembly steps
- Calibration and validation of simulation by experiment
- Technical lead of package simulation project tasks
- Development/improvement of simulation and back-end material characterization techniques
- Coordination of characterization of new materials and implementation of results in database
- Interface with package design, materials development, quality, and project teams
Who we are looking for
- Advanced university degree in Physics, Chemistry, Materials Science, Optics, Polymer / Mechanical / Semiconductor Engineering, or related fields
- 5+ year experience in continuum mechanics, modelling and FE simulation (COMSOL, Ansys, Abaqus)
- Experience in thermal and thermo-mechanical analysis of materials and constitutive modelling
- Basic knowledge of semiconductor package processes, as well as MEMS and CMOS manufacturing technologies is a benefit
- Experience in fracture mechanics / PoF or CFD modelling is a benefit
- CAD software skills are a benefit
- Demonstrated analytical and problem-solving skills
- Ability to translate complex problem statements into targeted solution-oriented simulation approaches
- Ability to work in & collaborate with diverse teams in multiple geographical locations
- Strong communication skills
- Fluent English
We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.
Contact

Yong Pan will be happy to answer any questions you may have.
Phone: +43 3136 500 32660
E-Mail: yong.pan@ams-osram.com
For data protection reasons, we only accept applications submitted through our applicant portal. This allows you to view the status of your application in your profile at any time.
Job details
Posting date: | 2025/05/19 |
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Experience level: | Professional (> 3 Years) |
Type of contract: | Permanent |
Employment type: | Full-time |
Work Model: | Hybrid |
Business unit: | CMOS Sensors & ASICs |
Organization: | ams-OSRAM AG |
Job field: | Research & Development |
Job ID: | 20912 |