Senior Technician / Associate Engineer (Wire Bond)
Bayan Lepas, Penang, Malaysia – OSRAM OS Penang
What we expect
· To instill a culture of open minded teams working together with individual responsibility mindset and develop sub-ordinates into a high performance team to ensure sustainable machine up time, MTBF, MTBA for Wire bond, VI & Thermography.
· Interact with process engineers to understand the equipment influences and capability that required for the process.
· Manages the effective interaction between engineering, manufacturing, field operations and marketing to ensure all changes are documented for audit purpose. Ex: PM checklist, process buy off checklist & etc.
· Assist in machine performance monitoring, troubleshooting, weekly PM, 5s, safety, daily task & etc.
· Support production for equipment conversion, change tool and buyoff.
· To collect machine performance data and report compilation. Ex: Shifly performance/conversion report & etc.
· To monitor and feedback machine or process performance during production.
Who we are looking for
- Diploma/Certificate in any relevant Engineering fields
- At least 2 years of direct and hands-on experiences with Wire bond, VI & Thermography equipment
- Willing to work in shift
Contact

Nur Diyana Abdul Raffar will be happy to answer any questions you may have.
E-Mail: nur-diyana.abdul-raffar@ams-osram.com
For data protection reasons, we only accept applications submitted through our applicant portal. This allows you to view the status of your application in your profile at any time.
Job details
Posting date: | 2025/06/05 |
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Experience level: | Professional (> 3 Years) |
Type of contract: | Permanent |
Employment type: | Full-time |
Work Model: | On site |
Business unit: | Opto Semiconductors (OS) |
Organization: | OSRAM OS Penang |
Job field: | Manufacturing |
Job ID: | 21009 |