Senior Staff Engineer, RD Packaging & Module Engineering
Wuxi, Jiangsu, China – OSCN
What we expect
- Leading Package design and process integration, leading design &DFMEA review with global team.
- Generate and maintain building block knowledge and sharing, Leading for X-projects Building Block development for existing platform
- Ensure synergies (standardize & minimize number of qualified materials) for new product/package platform, taking care on platform fitness and development, leading platform technical risk assessment
- Enable and support Dt-X(design to cost/test/manufacturability) Define Building Block design rules, regular alignment between site PDI's
- Triger necessary projects for performance improvement for existing product/package platform (past Q5), Develop derivates/improve platform (test new materials, …) Mentoring for new PDIs in WUXI, DMPC facilitator for new package &platform design workshop
Who we are looking for
- Bachelor >10yrs or Master >7yrs working experience in in LED process like die bonding, wire bonding, casting/molding, Trim&From and Sawing.
- Experienced in package design, process integration, simulation, and project management, Familiar with DFMEA, DFSS, QFD and Six Sigma
- CET-4 Minimum, CET-6 preferred. Familiar with Solidworks
- Can fluently use different version of office software
Contact
Ke Li will be happy to answer any questions you may have.
Phone: +86 (185) 50919625
E-Mail: ke.li@ams-osram.com
For data protection reasons, we only accept applications submitted through our applicant portal. This allows you to view the status of your application in your profile at any time.
Job details
Posting date: | 2024/12/06 |
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Experience level: | Experienced Professional (>8 Years) |
Type of contract: | Permanent |
Employment type: | Full-time |
Work Model: | On site |
Business unit: | Opto Semiconductors (OS) |
Organization: | OSCN |
Job field: | Research & Development |
Job ID: | 19698 |