Die Attach/Wire Bond Process Development Senior/Staff Engineer
Bayan Lepas, Penang, Malaysia – OSRAM OS Penang
What we expect
- Coordinates and supervises all Die attach & Wire Bond project activities and operations in assembly process/ integration phase of R&D projects.
- Lead a team of Process Development Engineers and Support Technicians to execute & monitor Die attach & Wire Bond activities from process development to product realization and subsequently leading to successful mass volume production.
- Plans and administers work, ensuring maximum productivity and cost efficiency from development to product realization.
Who we are looking for
- Min Bachelor's Degree in Electrical / Electronics / Mechanical Engineering, Chemical or equivalent.
- Preferred with working experience in HVM environment for IC or Led manufacturing.
- 3-5 years in HVM experience in IC/LED/Semiconductor R&D environment especially in Die Attach & Wire Bond process scope.
- Technical knowledge in semiconductor or LED backend assembly processes.
- 6 Sigma Methodology, Green/Black Belt is an advantage.
- MS Office Competent
Contact
Nurul Ain Rosli will be happy to answer any questions you may have.
E-Mail: nurul-ain.rosli@ams-osram.com
For data protection reasons, we only accept applications submitted through our applicant portal. This allows you to view the status of your application in your profile at any time.
Job details
Posting date: | 2024/11/08 |
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Experience level: | Experienced Professional (>8 Years) |
Type of contract: | Permanent |
Employment type: | Full-time |
Work Model: | On site |
Business unit: | Opto Semiconductors (OS) |
Organization: | OSRAM OS Penang |
Job field: | Research & Development |
Job ID: | 19461 |