Wire Bond Equipment Staff Engineer
巴六拜, 槟城, 马来西亚 – OSRAM OS Penang
职位要求
- Perform preventive and corrective maintenance on wire bonders (e.g., Shinkawa, ASM, etc.).
- Diagnose and resolve equipment-related issues to minimize downtime.
- Lead root cause analysis (RCA) for recurring failures and implement corrective actions.
- Optimize wire bonding parameters (e.g., force, ultrasonic power, temperature) to improve yield and throughput.
- Conduct DOE (Design of Experiments) to enhance process stability and performance.
- Work with process engineers to qualify new materials (wire types, capillaries) and bond pad designs.
- Evaluate and qualify new wire bonding equipment and technologies.
- Lead installation, commissioning, and validation of new bonders.
- Develop and document Standard Operating Procedures (SOPs) and best-known methods (BKMs).
- Analyze bond strength, pull test data, and shear test results to ensure quality standards.
- Collaborate with quality and reliability teams to address bond-related defects.
- Implement SPC (Statistical Process Control) to monitor process stability.
- Work with production, process integration, and R&D teams to meet product requirements.
- Support failure analysis (FA) for wire bond-related issues in packaged devices.
- Train technicians and junior engineers on equipment operation and maintenance.
- Identify opportunities to improve equipment uptime, cycle time, and consumable lifespan.
- Drive cost-saving initiatives through process optimization and vendor collaboration.
联系我们
Nurul Ain Rosli 将很乐意回答您的任何问题。
电子邮件地址: nurul-ain.rosli@ams-osram.com
出于信息保护的原因，我们仅接受官方岗位申请渠道的申请投递。您也可以通过岗位主页查询您的申请进度。
工作细节
| 发布日期: | 2025/06/05 |
|---|---|
| 经验水平: | 经验丰富的专业人士（> 8年） |
| 合同类型: | 正式 |
| 时间安排: | 全职 |
| 工作模式: | 不可能 |
| 业务单元: | Opto Semiconductors (OS) |
| 组织: | OSRAM OS Penang |
| 工作领域: | 工业 |
| 工作编号: | 21005 |
