Equipment Maintenance & Troubleshooting:

• Perform preventive and corrective maintenance on wire bonders (e.g., Shinkawa, ASM, etc.).
• Diagnose and resolve equipment-related issues to minimize downtime.
• Lead root cause analysis (RCA) for recurring failures and implement corrective actions.

Process Optimization:

• Optimize wire bonding parameters (e.g., force, ultrasonic power, temperature) to improve yield and throughput.
• Conduct DOE (Design of Experiments) to enhance process stability and performance.
• Work with process engineers to qualify new materials (wire types, capillaries) and bond pad designs.

New Equipment & Technology Development:

• Evaluate and qualify new wire bonding equipment and technologies.
• Lead installation, commissioning, and validation of new bonders.
• Develop and document Standard Operating Procedures (SOPs) and best-known methods (BKMs).

Yield & Quality Improvement:

• Analyze bond strength, pull test data, and shear test results to ensure quality standards.
• Collaborate with quality and reliability teams to address bond-related defects.
• Implement SPC (Statistical Process Control) to monitor process stability.

Cross-functional Collaboration:

• Work with production, process integration, and R&D teams to meet product requirements.
• Support failure analysis (FA) for wire bond-related issues in packaged devices.
• Train technicians and junior engineers on equipment operation and maintenance.

Continuous Improvement & Cost Reduction:

• Identify opportunities to improve equipment uptime, cycle time, and consumable lifespan.
• Drive cost-saving initiatives through process optimization and vendor collaboration.