Process Integration Engineer TSV (d/m/f)
普雷姆施泰滕, 施蒂利亚州, 奥地利 – ams-OSRAM AG
职位要求
- PI (process integration) representative for TSV (Through-Silicon-Via) technology
- Supervise and monitor manufacturing of the process technology in close teamwork with single process engineering, process R&D, QA, etc.
- Maintain process deliveries (e.g. FMEA, PCP, etc.) and lead cross-functional discussions
- Optimize processes and solve process problems in close teamwork with different departments (e.g. Test, Product Engineering, Design, Design Support, QA, etc.)
- Evaluate and implement possible process simplifications / improvements in order to lower manufacturing costs and increase process and product robustness
- Improve product yield via defect engineering perform physical failure analyses in close cooperation with other departments / teams (e.g. defect, FA team, etc.)
联系我们
Hana Krsul 将很乐意回答您的任何问题。
电话: +43 664 9665611
电子邮件地址: hana.krsul@ams-osram.com
出于信息保护的原因，我们仅接受官方岗位申请渠道的申请投递。您也可以通过岗位主页查询您的申请进度。
工作细节
| 发布日期: | 2025/02/19 |
|---|---|
| 经验水平: | 专业（> 3年) |
| 合同类型: | 正式 |
| 时间安排: | 全职 |
| 工作模式: | 混合 |
| 业务单元: | CMOS Sensors & ASICs |
| 组织: | ams-OSRAM AG |
| 工作领域: | 工业 |
| 工作编号: | 20244 |
