FEA Simulation Engineer - Sensor Assembly R&D (d/m/f)
普雷姆施泰滕, 施蒂利亚州, 奥地利 – ams-OSRAM AG
职位要求
- Reliability simulation and risk assessment of optical sensor packages with focus on thermal and (thermo-)mechanical design
- Process modelling of critical packaging assembly steps
- Calibration and validation of simulation by experiment
- Technical lead of package simulation project tasks
- Development/improvement of simulation and back-end material characterization techniques
- Coordination of characterization of new materials and implementation of results in database
- Interface with package design, materials development, quality, and project teams
联系我们
Yong Pan 将很乐意回答您的任何问题。
电子邮件地址: yong.pan@ams-osram.com
出于信息保护的原因，我们仅接受官方岗位申请渠道的申请投递。您也可以通过岗位主页查询您的申请进度。
工作细节
| 发布日期: | 2025/05/19 |
|---|---|
| 经验水平: | 专业（> 3年) |
| 合同类型: | 正式 |
| 时间安排: | 全职 |
| 工作模式: | 混合 |
| 业务单元: | CMOS Sensors & ASICs |
| 组织: | ams-OSRAM AG |
| 工作领域: | 研发 |
| 工作编号: | 20912 |
