Die Attach/Wire Bond Process Development Senior/Staff Engineer
巴六拜, 槟城, 马来西亚 – OSRAM OS Penang
职位要求
- Coordinates and supervises all Die attach & Wire Bond project activities and operations in assembly process/ integration phase of R&D projects.
- Lead a team of Process Development Engineers and Support Technicians to execute & monitor Die attach & Wire Bond activities from process development to product realization and subsequently leading to successful mass volume production.
- Plans and administers work, ensuring maximum productivity and cost efficiency from development to product realization.
联系我们
Nurul Ain Rosli 将很乐意回答您的任何问题。
电子邮件地址: nurul-ain.rosli@ams-osram.com
出于信息保护的原因，我们仅接受官方岗位申请渠道的申请投递。您也可以通过岗位主页查询您的申请进度。
工作细节
| 发布日期: | 2024/11/08 |
|---|---|
| 经验水平: | 经验丰富的专业人士（> 8年） |
| 合同类型: | 正式 |
| 时间安排: | 全职 |
| 工作模式: | 不可能 |
| 业务单元: | Opto Semiconductors (OS) |
| 组织: | OSRAM OS Penang |
| 工作领域: | 研发 |
| 工作编号: | 19461 |
