Sr. Staff Engineer, RD Packaging & Module Engineering

Position Summary (岗位描述)
Product design and process integration to ensure New Product/Process/Material are meeting requirement, stable and well-integrated into manufacturing line with all quality reliability issue assessed and addressed prior release for product launch.
负责产品封装设计和工艺整合以满足新产品/工艺和材料符合开发要求，在产品量产前进行质量和可靠性评估使其稳定和完好地整合到产线。
Key Responsibility (主要职责)
1. Lead Package design and process integration, lead design DFMEA review with global team
领导LED封装设计和工艺整合，领导与国际团队的设计FMEA的评审
2. Generate and maintain building block knowledge and sharing, Lead for X-projects Building Block development for existing platform
生成和维护封装构成要素的知识并分享，领导针对已有产品平台的X项目的封装构成要素的开发。
3. Ensure synergies (standardize minimize number of qualified materials) for new product/package platform, taking care on platform fitness and development, platform technical risk assessment
确保新产品和新产品平台的协同效应（标准化尽量减少认证材料），关注产品平台的健康与发展，领导产品平台的技术风险评估。
4. Enable and support Dt-X(design to cost/test/manufacturability)
确保和支持设计符合成本/测试/可制造性的要求
5. Define Building Block design rules, regular alignment between site PDI's
制定封装构成要素的设计规则并定期性地与全球PDI协调一致。
6. Triger necessary projects for performance improvement for existing product/package platform (past Q5), Develop derivates/improve platform (test new materials, …)
启动已有产品/产品平台绩效改善项目（Q5以后），开发衍生产品/改善产品平台（如测试新材料）
7. Consultant and supporting technical issues/complaints related to design from operation
对来自运营部门的与设计相关的技术问题/客户投诉提供技术咨询和支持
8. Other tasks assigned by Supervisor
主管安排的其他工作

Qualification (任职者要求)

10年以上的LED工艺经验，如芯片贴片工艺，引线键合工艺，注胶/塑封工艺，切筋成型和切割工艺

有封装设计、工艺整合、模拟和项目管理的经验，熟悉DFMEA, DFSS, QFD and Six Sigma

候选人要求通过最低英语四级，优先考虑六级，熟悉使用Solidworks

熟练使用不同版本的办公软件

其他：能在压力下工作并适应快速变化的工作，具有团队合作精神