Wire Bond Senior Process Engineer
Bayan Lepas, Penang, Malaysia – OSRAM OS Penang
What we expect
- Responsible for line sustaining issues & full accountability of outgoing yield and quality of Wire Bond process. KPIV, KPOV & LoD are key. Updating documentation on a timely manner (FMEA, WI, POCAP, CP, Build sheetetc).
- Hands on & run the equipment/process in production mode. Expected to spend time on the production floor daily.
- Equip with wire bond process knowledge through self-learning and able to do some minor troubleshooting whenever there are any quality/maverick issues occur.
- Work closely with cross functional team like equipment, PO & Quality team on any issues arise.
- Work closely with R&D for new product development to ensure robust process & manufacturability. Support new product pre-series and ramp-up.
- Initiate cost & yield improvement projects which may need to drive the upstream process on any incoming quality deviations.
Who we are looking for
- Min Bachelor's Degree in Electrical / Electronics / Mechanical Engineering or equivalent.
- Preferred with min 3-5 years working experience in High Volume Manufacturing and Complex process for IC or LED manufacturing.
- Experience in the Wire Bond process is highly preferred.
- 6 Sigma Methodology, Green/Black Belt is an advantage.
- Process control knowledge-Control Plan, FMEA, SPC, MSA, 8D, DOE, Minitab, PBI.
Contact
Nurul Ain Rosli will be happy to answer any questions you may have.
E-Mail: nurul-ain.rosli@ams-osram.com
Application deadline: as long as the job is listed on our career page, we are looking for suitable candidates (all genders welcome). We are looking forward to receiving your application.
Job details
| Posting date: | 2024/09/26 |
|---|---|
| Experience level: | Professional (> 3 Years) |
| Type of contract: | Permanent |
| Employment type: | Full-time |
| Work Model: | On site |
| Business unit: | Opto Semiconductors (OS) |
| Organization: | OSRAM OS Penang |
| Job field: | Manufacturing |
| Job ID: | 19161 |
