Process Development Senior Technician (Die Attach/Wire Bond)

Assist engineer in new process and equipment set up.

• Co-ordination of equipment shipment and setup.
• Assist in machine performance monitoring and troubleshooting
• Assist in machine performance data collection and report compilation.
• To follow up with the preparation of buyoff material and machine parts.
• Provide training to operators if necessary.
• Co-ordinate with supplier (field engineer) for technical support.
• Assist in equipment conversion and buyoff.

Assist engineer in process / equipment parameters optimization.

• Assist in DOE run for process optimization and parameter windows setting.
• To follow up with the preparation of DOE material and machine parts.
• To collect machine performance data and report compilation.

Assist engineer in engineering build for customer samples and qual samples.

• To run new machince or process for early stage of engineering build, before taken over by operator.
• To monitor and feedback machine or process performance during engineering build.
• Provide training to operators if necessary.

Assist engineer in documentation.
To assists engineer in documentation such as Work Instruction, Build Sheet and Process Specification.

• Post Matriculation Certification or Polytechnic Diploma/Advanced VocationalDiploma in Mechanical / Electrical amp; Electronic Engineering.
• 2-3 years relevant working experience with semiconductor companies especially in Die Attach amp; Wire Bonding process.
• Has multi tasking capability. Able to work extra hours, and during weekends. Able to work as a team and hasknowledge sharing capability.
• Computer skills - MS Word, Powerpoint, Excel, Micosoft Project.