Engineer, RD Packaging & Module Engineering(Molding)
Wuxi, China – OSCN
What we expect
Position Summary (岗位描述)
Leading the casting molding process development to ensure New Product are meeting requirement, stable and well-integrated into manufacturing line with all quality reliability issue assessed and addressed prior release for product launch.
负责注胶和塑封工艺的开发以满足新产品符合开发要求,在产品量产前进行质量和可靠性评估使其稳定和完好地整合到产线
Key Responsibility (主要职责)
1. Leading Casting/Molding process development following the process robustness guideline for new products development to meet the product quality, yield, and manufacturability requirements
在工艺稳健开发指导文件的指导下,领导新产品的注胶/塑封工艺的开发以满足产品的质量、良率和可制造性的要求
2. Leading Casting/Molding parameter study by DOE, generate/update the document like the WI, control plan and Build-sheet, responsible for training to technician/operator before handover to production
通过DOE的方法主导工艺参数的研究,生成和更新文件如WI,控制计划书,Build-sheet,在产品交接给生产之前负责培训生产的技术员和操作员
3. Carry out process optimization tasks by DOE methodology. Utilize experience knowledge for complex problem solving by why-why analysis, and provide solution with Poke-Yoke concept. Enable and support Dt-X(design to cost/test/manufacturability)
通过DOE的方法优化工艺,利用经验和知识并使用why-why的分析方法解决复杂问题,为Poke-Yoke防错系统提供解决方案,支持和确保设计符合成本/测试/可制造性的要求
4. Leading new process/equipment Technology project, improvement project when necessary
5. 领导新工艺/新设备的开发项目,以及必要的改善项目Supporting the DFMEA updates, risk assessment for new product development, leading PFMEA updating
6. Supporting and consultant for technical issues/complaints related to the process development requested by Operation
对来自运营部门的与工艺开发相关的技术问题/客户投诉提供技术咨询和支持
7. Other tasks assigned by supervisor
主管安排的其他工作
Who we are looking for
Qualification (任职者要求)
1. Bachelor's degree or master's in electrical /Electronic Engineering /Material Science/semiconductor field
电子/电气工程,材料学专业或半导体领域的学士或硕士学位
2. Above 5years working experience in LED process like casting/molding, Familiar with Protech casting machine, TOWA molding machine or other casting/molding machine model
5年以上的LED工艺如注胶或塑封经验,熟悉Protech注胶机,TOWA塑封机或其他注胶/塑封机型
3. Familiar MFMEA, PFMEA, DOE, JMP or Minitab is required, Familiar with DFMEA, DFSS, QFD and Six Sigma preferred
熟悉MFMEA, PFMEA, DOE, JMP or Minitab软件,择优熟悉DFMEA, DFSS, QFD 和 Six Sigma的候选人
4. CET-4 Minimum, CET-6 preferred.
候选人要求通过最低英语四级,择优考虑六级
5. Can fluently use different version of office software
熟练使用不同版本的办公软件
6. Others: Able to work with stress and adapt to fast changes; Good team player.
其他:能在压力下工作并适应快速变化的工作,具有团队合作精神
Contact

Ke Li will be happy to answer any questions you may have.
E-Mail: ke.li@ams-osram.com
Application deadline: as long as the job is listed on our career page, we are looking for suitable candidates (all genders welcome). We are looking forward to receiving your application.
Job details
Posting date: | 2023/09/15 |
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Experience level: | Early Professional (0-3 Years) |
Type of contract: | Permanent |
Schedule: | Full-time |
Remote work: | Not Specified |
Business unit: | Opto Semiconductors (OS) |
Organization: | OSCN |
Job field: | Research & Development |
Job ID: | 15686 |