Wire Bond Equipment Staff Engineer
Bayan Lepas, Penang, Malaysia – OSRAM OS Penang
Deine Aufgaben
- Perform preventive and corrective maintenance on wire bonders (e.g., Shinkawa, ASM, etc.).
- Diagnose and resolve equipment-related issues to minimize downtime.
- Lead root cause analysis (RCA) for recurring failures and implement corrective actions.
- Optimize wire bonding parameters (e.g., force, ultrasonic power, temperature) to improve yield and throughput.
- Conduct DOE (Design of Experiments) to enhance process stability and performance.
- Work with process engineers to qualify new materials (wire types, capillaries) and bond pad designs.
- Evaluate and qualify new wire bonding equipment and technologies.
- Lead installation, commissioning, and validation of new bonders.
- Develop and document Standard Operating Procedures (SOPs) and best-known methods (BKMs).
- Analyze bond strength, pull test data, and shear test results to ensure quality standards.
- Collaborate with quality and reliability teams to address bond-related defects.
- Implement SPC (Statistical Process Control) to monitor process stability.
- Work with production, process integration, and R&D teams to meet product requirements.
- Support failure analysis (FA) for wire bond-related issues in packaged devices.
- Train technicians and junior engineers on equipment operation and maintenance.
- Identify opportunities to improve equipment uptime, cycle time, and consumable lifespan.
- Drive cost-saving initiatives through process optimization and vendor collaboration.
Kontakt
Nurul Ain Rosli steht Dir bei Fragen gerne zur Verfügung.
E-Mail: nurul-ain.rosli@ams-osram.com
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Job-Details
| Veröffentlichungsdatum: | 05.06.2025 |
|---|---|
| Einstiegslevel: | Berufserfahrene (> 8 Jahre) |
| Vertragsart: | Festanstellung |
| Beschäftigungsart: | Vollzeit |
| Arbeitsmodell: | Vor Ort |
| Geschäftsbereich: | Opto Semiconductors (OS) |
| Organisation: | OSRAM OS Penang |
| Einsatzbereich: | Produktion |
| Stellennummer: | 21005 |
